TMS320LF2406APZA Texas Instruments IC MCU 16BIT 64KB FLASH 100LQFP

2024/02/1 115

CATALOG

Taiwan (Province of China)

Philippines

Data Bus Width (bit)	16
Family Name	C2000
Device Core	C2xx DSP
Instruction Set Architecture	Harvard
Maximum Clock Rate (MHz)	40
Program Memory Type	Flash
Program Memory Size	64KB
RAM Size	5KB
Maximum CPU Frequency (MHz)	40
Number of Programmable I/Os	41
Number of Timers	4
ADC Channels	16
ADC Resolution (bit)	10
Number of ADCs	Single
Interface Type	CAN/SCI/SPI
Programmability	Yes
SPI	1
I2C	0
I2S	0
UART	0
USART	0
CAN	1
USB	0
Ethernet	0
Minimum Operating Supply Voltage (V)	3
Typical Operating Supply Voltage (V)	3.3
Maximum Operating Supply Voltage (V)	3.6
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85
Temperature Flag	Opr
Operating Supply Voltage (V)	3.3
Maximum Storage Temperature (°C)	150
Minimum Storage Temperature (°C)	-65

Supplier Package	LQFP
Basic Package Type	Lead-Frame SMT
Pin Count	100
Lead Shape	Gull-wing
PCB	100
Tab	N/R
Pin Pitch (mm)	0.5
Package Length (mm)	14.2(Max)
Package Width (mm)	14.2(Max)
Package Height (mm)	1.45(Max)
Package Diameter (mm)	N/R
Package Overall Length (mm)	16.2(Max)
Package Overall Width (mm)	16.2(Max)
Package Overall Height (mm)	1.6(Max)
Seated Plane Height (mm)	1.6(Max)
Mounting	Surface Mount
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Low Profile Quad Flat Package
Package Family Name	QFP
Jedec	MS-026

MSL	2
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	J-STD-020D
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Au
Under Plating Material	Pd over Ni
Terminal Base Material	Cu Alloy
Number of Wave Cycles	N/R