10M25SAE144I7G Intel / Altera IC FPGA 101 I/O 144EQFP

label:
2023/08/30 189



CATALOG
10M25SAE144I7G COUNTRY OF ORIGIN
10M25SAE144I7G PARAMETRIC INFO
10M25SAE144I7G PACKAGE INFO
10M25SAE144I7G MANUFACTURING INFO
10M25SAE144I7G PACKAGING INFO
10M25SAE144I7G ECAD MODELS


COUNTRY OF ORIGIN
Malaysia
Philippines


PARAMETRIC INFO
Device Logic Units 25000
Device Logic Cells 25000
Maximum Number of User I/Os 101
Device Number of DLLs/PLLs 4
Number of Multipliers 55 (18x18)
RAM Bits (Kbit) 675
Program Memory Type SRAM
Family Name MAX 10
Process Technology 55nm
Speed Grade 7
Differential I/O Standards Supported LVDS|SSTL|HSUL
External Memory Interface DDR2 SDRAM|LPDDR2 SDRAM|DDR3 SDRAM|DDR3L SDRAM
Copy Protection No
Shift Registers Utilize Memory
Programmability Yes
In-System Programmability Yes
Reprogrammability Support Yes
Number of Global Clocks 20
Maximum Operating Supply Voltage (V) 1.25
I/O Voltage (V) 1.2|1.35|1.5|1.8|2.5|3|3.3
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 100
Temperature Flag Jun
Supplier Temperature Grade Industrial
Digital Control Impedance No
Minimum Operating Supply Voltage (V) 1.15
Typical Operating Supply Voltage (V) 1.2
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package EQFP EP
Basic Package Type Lead-Frame SMT
Pin Count 144
Lead Shape Gull-wing
PCB 144
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 20
Package Width (mm) 20
Package Height (mm) 1.45
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.55
Mounting Surface Mount
Package Material Plastic
Package Family Name QFP
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3


PACKAGING INFO
Packaging Tray
Quantity Of Packaging 60
Packaging Document Link to Datasheet


ECAD MODELS


Produkt RFQ