XS1-L8A-64-TQ128-C5 XMOS IC MCU 32BIT 64KB SRAM 128TQFP

label:
2024/11/28 5
XS1-L8A-64-TQ128-C5 XMOS IC MCU 32BIT 64KB SRAM 128TQFP


CATALOG
XS1-L8A-64-TQ128-C5 COUNTRY OF ORIGIN
XS1-L8A-64-TQ128-C5 LIFECYCLE
XS1-L8A-64-TQ128-C5 PARAMETRIC INFO
XS1-L8A-64-TQ128-C5 PACKAGE INFO
XS1-L8A-64-TQ128-C5 MANUFACTURING INFO


COUNTRY OF ORIGIN
Korea (Republic of)


LIFECYCLE
Obsolete
Jul 31,2023


PARAMETRIC INFO
Family Name XS1-L
Data Bus Width (bit) 32
Device Core xCore
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 500
Program Memory Type ROMLess
RAM Size 64KB
Power On Reset No
Memory Protection Unit No
Temperature Sensor No
DDR No
Memory Management Unit No
Integrated Development Environment No
Super Scalar No
External Bus Interface No
Trace Hardware JTAG
Encryption Standard AES
Direct Memory Access No
Floating Point Unit No
Bluetooth No
Wi-Fi No
Multiply Accumulate No
Internal/External Clock Type External
Touch Sensing Interface No
Maximum CPU Frequency (MHz) 500
Number of Programmable I/Os 64
Number of Timers 10
Parallel Master Port No
Real Time Clock No
Interface Type USB
Programmability No
SPI 0
I2C 0
I2S 0
UART 0
USART 0
CAN 0
USB 1
Ethernet 0
Minimum Operating Supply Voltage (V) 3
Typical Operating Supply Voltage (V) 3.3
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 70
Temperature Flag Opr
Supplier Temperature Grade Commercial
Operating Supply Voltage (V) 3.3
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package TQFP EP
Basic Package Type Lead-Frame SMT
Pin Count 128
Lead Shape Gull-wing
PCB 128
Tab N/R
Pin Pitch (mm) 0.4
Package Length (mm) 14
Package Width (mm) 14
Package Height (mm) 1
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.2(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Thin Quad Flat Package, Exposed Pad
Package Family Name QFP
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) N/A
Under Plating Material N/A
Terminal Base Material N/A

Produkt RFQ