|
|
• Input Bias Current: 1pA (Typ at 25°C)
|
• Low Offset Voltage: 100μV Max
|
• Low Offset Drift: 2.5μV/°C Max
|
• 0.1Hz to 10Hz Noise: 1.5μVP-P
|
• Slew Rate: 40V/μs
|
• Gain Bandwidth Product: 50MHz
|
• Output Swings Rail-to-Rail
|
|
| CATALOG |
LTC6244HMS8#PBF COUNTRY OF ORIGIN
|
LTC6244HMS8#PBF PARAMETRIC INFO
|
LTC6244HMS8#PBF PACKAGE INFO
|
LTC6244HMS8#PBF MANUFACTURING INFO
|
LTC6244HMS8#PBF PACKAGING INFO
|
LTC6244HMS8#PBF ECAD MODELS
|
LTC6244HMS8#PBF APPLICATIONS
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|
COUNTRY OF ORIGIN
|
Malaysia
|
|
PARAMETRIC INFO
|
| Manufacturer Type |
High Speed Amplifier |
| Type |
High Speed Amplifier |
| Rail to Rail |
Rail to Rail Output |
| Number of Channels per Chip |
2 |
| Minimum Single Supply Voltage (V) |
2.8 |
| Process Technology |
CMOS |
| Minimum PSRR (dB) |
75 |
| Typical Single Supply Voltage (V) |
3|5 |
| Output Type |
CMOS |
| Maximum Single Supply Voltage (V) |
6 |
| Typical Gain Bandwidth Product (MHz) |
30(Min) |
| Maximum Input Offset Voltage (mV) |
0.125@5V |
| Maximum Input Offset Current (uA) |
0.0000005(Typ)@5V |
| Maximum Input Bias Current (uA) |
0.002@5V@-40C to 125C |
| Maximum Operating Supply Voltage (V) |
6 |
| Maximum Supply Voltage Range (V) |
6 to 9 |
| Minimum CMRR (dB) |
74 |
| Minimum CMRR Range (dB) |
71 to 75 |
| Typical Voltage Gain (dB) |
110.88(Min) |
| Typical Slew Rate (V/us) |
17(Min)@5V@-40C to 125C |
| Typical Settling Time (ns) |
535 |
| Typical Input Noise Voltage Density (nV/rtHz) |
8@5V |
| Typical Input Bias Current (uA) |
0.000001@5V |
| Typical Noninverting Input Current Noise Density (pA/rtHz) |
0.00056@5V |
| Shut Down Support |
No |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Automotive |
| Power Supply Type |
Single |
| Maximum Supply Current (mA) |
14.8@5V@-40C to 125C |
|
|
PACKAGE INFO
|
| Supplier Package |
MSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
3 |
| Package Width (mm) |
3 |
| Package Height (mm) |
0.86 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3 |
| Package Overall Width (mm) |
4.9 |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Micro Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-187AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Alloy 42 |
|
|
PACKAGING INFO
|
| Packaging |
Tube |
| Quantity Of Packaging |
50 |
|
|
ECAD MODELS
|
 |
|
| APPLICATIONS |
| • Photodiode Amplifi ers |
| • Charge Coupled Amplifi ers |
| • Low Noise Signal Processing |
| • Active Filters |
| • Medical Instrumentation |
| • High Impedance Transducer Amplifier |
| |
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