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• MEDIUM SPEED OPERATION : tPD = 80ns (TYP.) at VDD = 10V
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• FULLY STATIC OPERATION
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• COMMON RESET
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• BUFFERED INPUTS AND OUTPUTS
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• STANDARDIZED SYMMETRICAL OUTPUT CHARACTERISTICS
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• QUIESCENT CURRENT SPECIFIED UP TO 20V
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• INPUT LEAKAGE CURRENT II = 100nA (MAX) AT VDD = 18V TA = 25°C
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• 100% TESTED FOR QUIESCENT CURRENT
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• MEETS ALL REQUIREMENTS OF JEDEC JESD13B ” STANDARD SPECIFICATIONS FOR DESCRIPTION OF B SERIES CMOS DEVICES”
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|
| CATALOG |
HCF4040BEY COUNTRY OF ORIGIN
|
HCF4040BEY PARAMETRIC INFO
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HCF4040BEY PACKAGE INFO
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HCF4040BEY MANUFACTURING INFO
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HCF4040BEY PACKAGING INFO
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HCF4040BEY ECAD MODELS
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|
COUNTRY OF ORIGIN
|
China
|
|
PARAMETRIC INFO
|
| Logic Function |
Counter/Divider |
| Logic Family |
4000B |
| Process Technology |
CMOS |
| Number of Count Input Enables |
0 |
| Number of Element Inputs |
1 |
| Number of Element Outputs |
12 |
| Number of Elements per Chip |
1 |
| Number of Selection Inputs per Element |
0 |
| Number of Stages |
12 |
| Operation Mode |
UP Counter |
| Direction Type |
Uni-Directional |
| Terminal Count Output |
No |
| Triggering Type |
Negative-Edge |
| Type |
Binary |
| Minimum Operating Supply Voltage (V) |
3 |
| Maximum Operating Supply Voltage (V) |
20 |
| Typical Operating Supply Voltage (V) |
3.3|5|9|12|15|18 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
125 |
| Maximum Propagation Delay Time @ Maximum CL (ns) |
360@5V|160@10V|130@15V |
| Absolute Propagation Delay Time (ns) |
360 |
| Propagation Delay Test Condition (pF) |
50 |
| Maximum Quiescent Current (mA) |
0.1 |
| Parallel Enable Input |
No |
|
|
PACKAGE INFO
|
| Supplier Package |
PDIP |
| Basic Package Type |
Through Hole |
| Pin Count |
16 |
| Lead Shape |
Through Hole |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
2.54 |
| Package Length (mm) |
20(Max) |
| Package Width (mm) |
7.1(Max) |
| Package Height (mm) |
5.1(Max) - 0.51(Min) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
N/A |
| Mounting |
Through Hole |
| Package Material |
Plastic |
| Package Description |
Plastic Dual In Line Package |
| Package Family Name |
DIP |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
N/R |
| Maximum Reflow Temperature (°C) |
N/R |
| Reflow Solder Time (Sec) |
N/R |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
| Number of Wave Cycles |
2 |
|
|
PACKAGING INFO
|
| Packaging |
Tube |
| Quantity Of Packaging |
25 |
| Packaging Document |
Link to Datasheet |
|
|
| ECAD MODELS |
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| |
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